・For the adsorption of small components such as IC chips
Series | Pad form | Pad diameter(mm) |
---|---|---|
ZP2 | Nozzle type | φ0.8,φ1.1 |
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・For the adsorption of small components such as IC chips
Series | Pad form | Pad diameter(mm) |
---|---|---|
ZP2 | Nozzle type | φ0.8,φ1.1 |
SMC